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W2465A 8K x 8 HIGH-SPEED CMOS STATIC RAM
GENERAL DESCRIPTION
The W2465A is a high-speed, low-power CMOS static RAM organized as 8192 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* *
High-speed access time: 12/15/20 nS (max.) Low-power consumption: - Active: 400mW (typ.) Single +5V power supply Fully static operation
* * *
All inputs and outputs directly TTL compatible Three-state outputs Available packages: 28-pin 300 mil SOJ and skinny DIP
* *
PIN CONFIGURATION
BLOCK DIAGRAM
VDD VSS A0 . . A12
NC A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VDD WE CS2
DECODER
CORE C O RE ARRAY
CS2
A8 A9 A11 OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4
CS1 OE WE
CONTROL
DATA I/O
I/O1 . . I/O8
PIN DESCRIPTION
SYMBOL A0-A12 I/O1-I/O8 CS1, CS2
WE OE VDD VSS NC
DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs Write Enable Input Output Enable Input Power Supply Ground No Connection
-1-
Publication Release Date: October 1995 Revision A6
W2465A
DC CHARACTERISTICS
Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
TRUTH TABLE
CS1 H X L L L CS2 X L H H H OE X X H L X WE X X H H L MODE Not Selected Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD
OPERATING CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current
SYM. VIL VIH ILI ILO
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, CS1 = VIH or CS2 = VIL or OE = VIH or WE = VIL IOL = +8.0 mA IOH = -4.0 mA 12 CS1 = VIL CS2 = VIH I/O = 0 mA Cycle = MIN Duty = 100% 15 20
MIN. -0.5 +2.2 -10 -10
TYP. -
MAX. +0.8 VDD +0.5 +10 +10
UNIT V V A A
VOL VOH IDD
2.4 -
-
0.4 180 150 120 30
V V mA mA mA mA
Standby Power Supply Current
ISB
CS1= VIH or CS2 = VIL Cycle = MIN Duty = 100% CS1 VDD -0.2V or CS2 0.2V
ISB1
-
-
5
mA
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
-2-
W2465A
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC TEST CONDITIONS
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS
AC TEST LOADS AND WAVEFORM
R1 480 ohm R1 480 ohm 5V OUTPUT 30 pF Including Jig and Scope R2 255 ohm 5V OUTPUT 5 pF Including Jig and Scope R2 255 ohm
(For TCLZ1, TCLZ2, TOLZ, TCHZ1, TCHZ2, TOHZ, TWHZ, TOW )
3.0V
90% 10% 5 nS 10%
90%
0V
5 nS
-3-
Publication Release Date: October 1995 Revision A6
W2465A
AC CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
Read Cycle
PARAMETER SYM. W2465A-12 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z
CS1 CS1
W2465A-15 MIN. 15 3 3 0 3 MAX. 15 15 15 7 7 7 7 -
W2465A-20 MIN. 20 3 3 0 3 MAX. 20 20 20 10 10 10 10 -
UNIT
MAX. 12 12 12 6 6 6 6 -
TRC TAA TACS1 TACS2 TAOE TCLZ1* TCLZ2* TOLZ* TCHZ1* TCHZ2* TOHZ* TOH
12 3 3 0 3
nS nS nS nS nS nS nS nS nS nS nS nS
CS2
CS2
Output Enable to Output in Low Z Chip Deselection to Output in High Z
CS1
CS2
Output Disable to Output in High Z Output Hold from Address Change
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETER SYM. W2465A-12 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time
CS1 , WE CS1
W2465A-15 MIN. 15 13 13 13 0 10 0 0 9 0 0 MAX. 8 8 -
W2465A-20 MIN. 20 17 17 17 0 12 0 0 10 0 0 MAX. 10 10 -
UNIT
MAX. 7 7 -
TWC TCW1 TCW2 TAW TAS TWP TWR1 TWR2 TDW TDH TWHZ* TOHZ* TOW
12 10 10 10 0 10 0 0 7 0 0
nS nS nS nS nS nS nS nS nS nS nS nS nS
CS2
CS2 Data Valid to End of Write
Data Hold from End of Write
Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write
* These parameters are sampled but not 100% tested.
-4-
W2465A
TIMING WAVEFORMS
Read Cycle 1 (Address Controlled)
TRC Address TOH D OUT TAA TOH
Read Cycle 2 (Chip Select Controlled)
CS1
TACS1 TCHZ1
CS2
TACS2 TCHZ2
TCLZ1 D OUT TCLZ2
Read Cycle 3 (Output Enable Controlled)
TRC
Address
TAA
OE
TAOE TOH
CS1
TOLZ TACS1 TCLZ1 TCHZ1
CS2
TACS2 TCLZ2 TCHZ2 TOHZ
DOUT
-5-
Publication Release Date: October 1995 Revision A6
W2465A
Timing Waveforms, continued
Write Cycle 1 (OE Clock)
TWC
Address
TWR1
OE
TCW1
CS1
CS2
TAW
TCW2 TWR2 TWP
WE
TAS TOHZ
(1, 4)
TDW TDH
DOUT
D IN
Write Cycle 2 (OE = VIL Fixed)
T WC Address TCW1 CS1 TWR1
CS2 TAW WE TAS
TCW2 TWR2 T WP TWHZ(1, 4) TOH TOW (2) (3)
DOUT TDW D IN TDH
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
-6-
W2465A
ORDERING INFORMATION
PART NO. W2465AK-12 W2465AK-15 W2465AK-20 W2465AJ-12 W2465AJ-15 W2465AJ-20 ACCESS TIME (nS) 12 15 20 12 15 20 OPERATING CURRENT Max. (mA) 180 150 120 180 150 120 STANDBY CURRENT Max. (mA) 5 5 5 5 5 5 PACKAGE 300 mil skinny 300 mil skinny 300 mil skinny 300 mil SOJ 300 mil SOJ 300 mil SOJ
Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
-7-
Publication Release Date: October 1995 Revision A6
W2465A
PACKAGE DIMENSIONS
28-pin P-DIP Skinny
Symbol
Dimension in Inches
Dimension in mm
Min. Nom.
0.010 0.125 0.016 0.058 0.008 0.130 0.018 0.060 0.010 1.388 0.300 0.283 0.090 0.120 0 0.330 0.350 0.310 0.288 0.100 0.130
Max.
0.175
Min. Nom.
0.25
Max.
4.45
D
28 15
E
1
A A1 A2 B B1 c D E E1 e1 L
a
0.135 0.022 0.064 0.014 1.400 0.320 0.293 0.110 0.140 15 0.370 0.055
3.18 0.41 1.47 0.20
3.30 0.46 1.52 0.25 35.26
3.43 0.56 1.63 0.36 35.56 8.13 7.44 2.79 3.56 15
7.62 7.19 2.29 3.05 0 8.38
7.87 7.32 2.54 3.30
1
14
eA S Notes:
8.89
9.40 1.40
S
2
E c
1
AA L B B1 e1
A
Base Plane
Mounting Plane
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec.
a
eA
28-pin Small Outline J Band
Symbol
Dimension in Inches
Dimension in mm
3.56 0.69
Min. Nom. Max. Min. Nom. Max.
0.140 0.027 0.095 0.026 0.016 0.008 0.100 0.028 0.018 0.010 0.710 0.295 0.044 0.245 0.327 0.077 0.300 0.050 0.265 0.337 0.087 0.105 0.032 0.022 0.014 0.730 0.305 0.056 0.285 0.347 0.097 0.045 0.004 0 10 0 7.49 1.12 6.22 8.31 1.96
28
15
E
H
E
1
14
A A1 A2 b1 b c D E e e1 HE L S y 0
Notes:
2.41 0.66 0.41 0.20
2.54 0.71 0.46 0.25 18.03 7.62 1.27 6.73 8.56 2.21
2.67 0.81 0.56 0.36 18.54 7.75 1.42 7.24 8.81 2.46 1.14 0.10 10
D c A L 0 e1 y
2
A
s Seating Plane
b b1
e
1
A
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec.
-8-
W2465A
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
-9-
Publication Release Date: October 1995 Revision A6

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